<span style='color:red'>SK hynix</span> Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction
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SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction

　　As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release.　　According to SK hynix, unlike conventional HBM designs that dissipate heat through the core die, iHBM integrates cooling elements (ICEs), made of thermally conductive, electrically non-conductive silicon-based materials, directly into the D2D PHY between HBM and GPUs, where heat is most concentrated. The company said the technology reduces thermal resistance by 30% and improves operating stability.　　As highlighted by SK hynix, the iHBM solution adopts a structural approach to thermal management by creating an additional heat dissipation path within the package. It also leverages the company’s wafer-level packaging (WLP) process and proven MR-MUF technology to enable stable high-volume manufacturing.　　In addition, its compatibility with existing System-in-Package (SiP) architectures allows customers to adopt the thermal solution with minimal design modifications, SK hynix adds.　　In terms of future roadmap, SK hynix plans to incorporate the iHBM solution into next-generation HBM products, including HBM5, with the goal of improving the stability and efficiency of HPC systems and AI data centers.　　Another Key Technology beyond Hybrid Bonding　　Alongside SK hynix’s latest iHBM solution, hybrid bonding is widely seen as a key approach to addressing heat dissipation challenges in 20-stack HBM, which, as previously reported by The Elec, are expected to become increasingly difficult.　　As explained in the report, hybrid bonding differs from conventional thermo-compression (TC) bonding, which connects chips through soldered micro-bumps. Instead, it bonds dielectric materials such as silicon dioxide (SiO₂) and copper through an annealing process at temperatures of roughly 200°C to 400°C.　　By heating and gradually cooling copper sealed within dielectric layers, thermal expansion and vertical pressure enable direct copper-to-copper diffusion bonding without reaching copper’s melting point, the report notes, adding this approach helps reduce thermal damage to semiconductor circuits while delivering improved thermal and electrical performance.
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Release time：2026-05-27 10:42 reading：375 Continue reading>>
SST and <span style='color:red'>SK hynix</span> system ic partner to expand availability of embedded SuperFlash technology
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SST and SK hynix system ic partner to expand availability of embedded SuperFlash technology

IC designers are increasingly seeking ways to keep production costs down while implementing low power, high endurance embedded flash. Microchip Technology Inc. via its subsidiary Silicon Storage Technology(SST) has announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology. The partnership will introduce SST’s embedded SuperFlash technology to SK hynix system ic’s 110 nanometer (nm) CMOS platform, providing designers a cost-effective and low-power embedded flash memory solution. SST’s embedded SuperFlash technology offers low power, high reliability, superior data retention and endurance for a range of applications, such as Internet of Things (IoT) devices, smart cards and microcontroller-based applications. The technology’s power efficiency and fast erase time are ideal for low-power applications such as remote IoT edge nodes and contactless payment devices.  “The combination of area-efficient, low-power SuperFlash technology and the highly cost-effective 110 nm process node opens up exciting new product opportunities, especially for IoT and microcontroller-based applications,” said Mark Reiten, vice president of SST, a wholly owned subsidiary of Microchip. “This partnership will enable customers who require low power, high endurance embedded flash to keep their production costs down by using the highly optimised 8-inch CMOS platform.”SST’s SuperFlash technology complements SK hynix system ic’s embedded flash memory solutions with low power and high reliability IP. SK hynix system ic is a fully owned subsidiary spun off from SK hynix (000660: Korea SE) in July 2017. It is a pure 200 mm foundry specialised in Display Driver IC (DDI), CMOS Image Sensor (CIS), and Power IC with a process range of 500 nm to 57 nm. “We believe that the adoption of SST’s embedded SuperFlash will enable SK hynix system ic to expand our technology portfolio, and it will help to respond to customer requests for highly reliable and robust embedded non-volatile memory solutions,” said Dr. SB You, marketing vice president of SK hynix system ic. “Moreover, we will provide customers with a cost-effective embedded flash solution to support their competitiveness in the market. As the demand for embedded flash memory solutions increases, there will be many customers coming to us to use our 110nm CMOS technology-based embedded flash memory solution.” The process development commenced earlier this year and is expected to be completed in early 2019. Contact SST for more information on the company’s extensive custom library of off-the-shelf IP blocks optimised for smartcard System-on-Chips (SoCs). 
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Release time：2018-12-17 00:00 reading：4143 Continue reading>>
Chipmaker SK Hynix posts record second-quarter profit
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Chipmaker SK Hynix posts record second-quarter profit

SeongJoon Cho | Bloomberg | Getty ImagesSouth Korean chipmaker SK Hynix posted record second-quarter operating profit on Thursday, beating market expectations thanks to strong sales of DRAM chips for servers.The world's No. 2 memory chipmaker said operating profit for April-June grew 83 percent to 5.6 trillion won ($5 billion) from 3.1 trillion won a year earlier.That compared with a 5.4 trillion won Thomson Reuters StarMine SmartEstimate from a survey of 21 analysts.Revenue for the period rose 55 percent from a year earlier to a record 10.4 trillion won, the company said.SK Hynix stock rose 1 percent on the result, after sliding more than 7 percent since Monday on analyst forecasts of a slowdown in DRAM sector performance.The results come as an industry-wide shift to new production technology raises market fears of oversupply that could spell the end of a cycle of strong price growth that has underpinned record profits for the past two years.
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Release time：2018-07-26 00:00 reading：4204 Continue reading>>
Nvidia's GTX 1180 production should kick off with the new SK Hynix memory deal
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Nvidia's GTX 1180 production should kick off with the new SK Hynix memory deal

Nvidia has signed a big chip deal with SK Hynix, putting the South Korean memory manufacturing giant in line for a large slice of Nvidia’s future financial successes with AI and data centre sales. And potentially with future GTX 1180-shaped graphics cards too.SK Hynix is the world’s second largest memory fab behind Samsung, and number four in the world for semiconductor sales behind TSMC, Intel, and Samsung - who is, again, in the very top spot.The memory manufacturer has already been enjoying a pretty stellar year, with huge worldwide memory demand that has seen system memory prices soar. But since the deal with Nvidia has entered the public domain, SK Hynix’s stocks have gone supersonic.Won’t settle for anything less than 4K? Don’t worry, the best Nvidia graphics cards are only a click away.Stocks are currently valued at 95,300 KRW apiece, toppling the previous high of the year of 90,700 KRW back in March. As a result of the Nvidia deal, this is the highest the semiconductor manufacturer’s stocks have been in 17 years.So what chips are SK Hynix providing Nvidia? From what we know of Nvidia’s next-generation of graphics cards (which is still very little, despite the recent Nvidia GTX 1180 rumours), we can only assume that SK Hynix will be providing GDDR6 for Nvidia’s GTX 1180 and further next-generation graphics cards. SK Hynix confirmed that its speedy GDDR6 memory modules were available for purchase earlier in the year, and this memory standard has been the most likely candidate to power Nvidia’s next gaming cards for some time.Nvidia’s current Volta generation Titan V utilises 12GB of HBM2 memory (which SK Hynix also make and assumedly supply to Nvidia in some capacity), although this on-package memory solution has been largely deemed too expensive and unnecessary for gaming cards - unfortunately, AMD’s RX Vega graphics cards had to find this out first hand.It’s all kicking off for SK Hynix and the company’s financials, and is likely the icing on the cake of what has already been an extremely successful year for the memory fab. Hopefully this newfound memory deal indicates signs of life within the Nvidia supply chain toward large-scale production of new product, and a good omen for gamers patiently waiting it out for new graphics cards from the green team.
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Release time：2018-05-24 00:00 reading：4561 Continue reading>>

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